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FINAL TEST

FINAL TEST

  • 01IQC A process in which Quality Control team inspects Wafer through designated devices or equipment before final TEST procedure based on the criteria agreed with customers
  • 02TEST A process to verify reliability of semiconductor by electrifying package to test its function at various level of temperature
  • 03MARKING A process to use Laser marking equipment to mark the name of manufacturer, date of manufacturing, product information on the surface of semiconductor packages
  • 04FVI/LIS A process to distinguish any normality or fault on the surface of finalized semiconductor package with naked eyes, microscope or devices or equipment for visual inspection
  • 05BAKE A process to remove water from the substrate surface of tested wafer by baking at high temperatures for a specific period of time
  • 06TAPE&REEL A process to pack the product with tape and reel according to customers' requests
  • 07QPV A process to test whether probe test has been undertaken properly through sampling test according to the customers' demands
  • 08PACKING A packing process of the approved products before shipping to accommodate the customers' requests
  • 09SHIPPING A delivering process of the packed products to customers

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